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Customer Advisories, Process Change Notifications, and Product Discontinuance Notifications

主页 > 设计软件及服务 > Customer Advisories, Process Change Notifications, and Product Discontinuance Notifications
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The following customer notifications are available on the Altera® website in Adobe Acrobat format.

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If you would like to receive customer notifications by e-mail, please subscribe to our customer notification mailing list.

Order Samples for PCNs

Some PCNs support an online ordering system. You can order up to two samples for each PCN. If you require more than two samples, please contact your local Altera sales representative.

Active PCNs supported by the online ordering system are listed below:

  • PCN 1105
  • PCN 1201
  • PCN 1205 (Note: Please place your sample requests by May 5, 2012)

Process Change Notifications
Title Release Date File Size
PCN 1201 Additional Assembly Source (ASE) for the MAX V Device Family Apr 2012141 KB
PCN 1205 Additional Assembly Source (ASE) and Transition to Center Pin Gate Mold for FBGA Packages Apr 2012514 KB
PCN 1105 Rev 1.3.0 Introducing "Green" Materials and Bill of Material Change for the Cyclone II and MAX II Devices Mar 2012528 KB
PCN 1106 Rev 1.2.0 Additional Bill of Materials and Suppliers for Altera's Flip Chip and Wirebond BGA Packages Oct 2011248 KB
PCN 1003 Rev 1.2.0 Alternative Assembly Site for the EPCS Serial Configuration Device Family Mar 2011231 KB
PCN 1102 Additional Wafer Fabrication Site for Stratix IV, Arria II, and HardCopy Devices Jan 2011210 KB
PCN 1002 Additional Assembly Source and Power Quad Flat Pack (RQFP) 208 and 240 Package Conversion Jun 201085 KB
PCN 0714 Rev 1.3.0 Assembly Plant Change for PQFP and TQFP Packages Jun 201060 KB
PCN 0904 Rev 1.2.0 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Jun 2010113 KB
PCN 0902 Rev 1.1.0 Additional Assembly Source and Bill of Material Change for Altera Flip Chip Products Feb 2010620 KB
PCN 0805 Rev 1.6.0 Wafer Fabrication Site Change for Serial Configuration Devices Dec 2009101 KB
PCN 0903 Rev 1.0.1 Alternative Assembly Site for the EPC Configuration Family Nov 200991 KB
PCN 0901 Rev 1.1.0 Substrate Change for Selected FBGA Packages Mar 2009205 KB
PCN 0513 Rev 1.2.1 Additional TSMC Wafer Fabrication Site Nov 200840 KB
PCN 0813 Polyimide Wafer Coat Removal for Selected Altera Devices Oct 200886 KB
PCN 0801 Rev 1.1.0 Alternative Manufacturing Site for EPCS Family Sep 200828 KB
PCN 0808 Wire-Bond Diameter Reduction for Selected TQFP Packages Sep 200878 KB
PCN 0803 Package-Lid Stiffener Change for the Stratix Flip-Chip Family Mar 200869 KB
PCN 0802 Additional TSMC Wafer Fabrication Site for Cyclone III FPGAs Feb 200824 KB
PCN 0715 Rev 1.1.1 Alternate Kyocera Substrate for Flip-Chip Packages Jan 200881 KB
PCN 0716 Additional TSMC Wafer Fabrication Site for Stratix GX FPGAs Nov 200724 KB
PCN 0708 Rev 1.1.0 Encapsulant Material Change for BGA Pb-Free Packages Oct 200730 KB
PCN 0712 Mold Compound Changes for BGA, UBGA, MBGA and FBGA Packages Oct 200787 KB
PCN 0702 Rev 1.2.0 Mold Compound Change for PQFP, PDIP, and RQFP Packages Sep 200797 KB
PCN 0710 Discontinuance of QFP Carriers for MAX 7000 Devices Jul 200728 KB
PCN 0707 Sealing Glass Change for Ceramic Dual In-Line Package Assembled in the Philippines Mar 200784 KB
PCN 0701 EPCS16SI16N Process Change Jan 200773 KB
PCN 0412 Rev01 FineLine BGA Substrate Second Source (Kinsus) Jul 200618 KB
PCN 0602 Mold Compound Change for Cyclone II PQFP & TQFP Packages Apr 200633 KB
PCN 0603 Cyclone II Family M4K Memory Block Modification Apr 2006125 KB
PCN 0517 Introducing Kinsus BT Substrate for BGA 600 and 652 Packages Mar 200674 KB
PCN 0515 Mold Compound Change for FPGA Packages Jan 200641 KB
PCN 0516 Mold Compound Change For PBGA Packages Dec 200539 KB
PCN 0514 Manufacturing Changes on EPCS Family Oct 200535 KB
PCN 0512 Implementing Standard Sumitomo-G6000 Series Mold Compound for PLCC Packages Aug 200532 KB
PCN 0506 Addition of Intel Flash Memory as Source for EPC4, EPC8 & EPC16 Enhanced Configuration Devices Aug 200561 KB
PCN 0504 Standardized EME-G700 Series Mold Compound for QFP Packages Jul 200532 KB
PCN 0415 Additional Mold Compound for FBGA Packages from ASE Malaysia Nov 200412 KB
PCN 0414 Standardized EME-G700 Mold Compound for TQFP Packages Nov 200416 KB
PCN 0413 Additional Wafer Fabrication Site (Fab 14 ) Jul 200420 KB
PCN 0410 Additional Assembly, Test, and FGI Location Jun 200420 KB
PCN 0411 Additional Test and Finished Goods Inventory Location Jun 200420 KB
PCN 0407 UFBGA 88 Package Substrate Change May 200411 KB
PCN 0404 Additional Mold Compound for TQFP 144 Package Mar 200411 KB
PCN 0310 Mold Compound Change for 100 Lead QFP Package Aug 20037 KB
PCN 0304 300 MM Wafer Schedule May 200314 KB
PCN 0216 New Wafer Fabrication Source Nov 200256 KB
PCN 0214 Copper Lid for Selected Altera BGA and FineLine BGA Packages Oct 200213 KB
PCN 0119 ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100 Nov 200114 KB
PCN 0116 Amkor Korea will be added as a second source for FineLine BGA packages currently assembled in ASAT, Hong Kong Oct 200111 KB
PCN 0114 Configuration Device Flash Memory Supply Source Addition Aug 20019 KB
PCN 0113 FineLine BGA and QFP Package Assembly Site Addition Aug 200110 KB
PCN 0109 ACEX 1K Device Process Improvement Jan 200110 KB
PCN 0010 MAX 3000A Device Process Transition Nov 200010 KB
PCN 0008 MAX 7000AE Device Process Transition Sep 200012 KB
PCN 0005 EP20K400 Device Process Migration Mar 200012 KB
PCN 9918 EPM7064 & EPM7064S Additional Source of Supply Dec 19999 KB
PCN 9915 EPF10K50V Device Process Transition Aug 199913 KB
PCN 9911 EPF10K50E And EPF10K200E Device Process Migration Jun 199914 KB
PCN 9903 EPF6010A, EPF6016A, and EPF6024A devices transition to a 0.3-micron process at WaferTech Jan 199916 KB
PCN 9901 FLEX 10K and FLEX 6016 devices transition to a 0.42-micron process at WaferTech Jan 199918 KB
PCN 9810 EPF10K50V, EPF10K10A, EPF10K30A, and EPF10K100A devices move to a 0.3-micron process Aug 199816 KB
PCN 9805 Additional source of supply for FLEX 10K and FLEX 6000 products May 199820 KB
PCN 9802 EPC1064 and EPC1213 Devices Feb 199822 KB
PCN 9703 MAX 7000 & MAX 9000 Feb 199785 KB
PCN 9702 Transition Schedule Update EPM7256E Feb 199784 KB
PCN 9616 Assembly & Test Site Addition Sep 199686 KB
PCN 9619 EPM7192E & EPM7256E Devices Sep 199690 KB
PCN 9612 Test & Shipment Site Addition Jun 199681 KB
PCN 9604 MAX 9000 devices transitioned to a 0.65 micron process Mar 199685 KB
PCN 9510 Transition of Classic devices to a 0.65-micron process Oct 199589 KB
PCN 9509 Preliminary reliability data for the 8" 0.6-micron FLEX 8000A devices Sep 199585 KB
PCN 9514 Additional source of supply for MAX 7000 devices Jun 199582 KB
PCN 9501 Reliability data and transition dates for the EPM7032 assembled in ASE Penang Jan 1995151 KB
PCN 9407 MAX 5000 to transition from a 0.8-micron EPROM process to a 0.65-micron EPROM process, 1994 Jul 199497 KB

Product Discontinuance Notices
Title Release Date File Size
PDN 0912 Altera will be discontinuing select APEX 20K ordering codes Oct 200920 KB
PDN 0911 Altera will be discontinuing select APEX 20KE ordering codes Sep 200920 KB
PDN 0906 Altera will be discontinuing the IP MegaCore® ordering codes listed in Table 1 of this document. Aug 200931 KB
PDN 0903 Rev 1.0.1 Altera will be discontinuing select MAX 7000B, MAX 7000 and MAX 7000S device ordering codes Jun 200926 KB
PDN 0704 Rev 1.1.0 Altera will be discontinuing the EPCS16SI16N ordering code Jan 200817 KB
PDN 0711 Altera will be discontinuing select APEX 20KC, APEX II, FLEX 8000, MAX 7000B, MAX 9000, and Excalibur ordering codes May 200719 KB
PDN 0706 Rev 2 Altera will be discontinuing select APEX 20K, APEX II, FLEX 8000, MAX 9000, and Excalibur ordering codes Feb 200722 KB
PDN 0705 Altera will be discontinuing the EPM7096 products Feb 200716 KB
PDN 0703 Altera will be discontinuing the PL-APU ordering code Feb 200712 KB
PDN 0610: Altera will be discontinuing select programming adapter ordering codes Dec 200618 KB
PDN 0609: Altera will be discontinuing the PL-MASTERBLASTER ordering code Dec 200612 KB
PDN 0605 Altera will be discontinuing the remaining Classic device ordering codes Jul 200620 KB
PDN 0604 Altera will be discontinuing select Classic device ordering codes Jun 200662 KB
PDN 0518 Altera will be discontinuing select APEX II, APEX 20K, APEX 20KC, APEX 20KE,Classic, FLEX 8000, MAX 3000A, MAX 7000, MAX 7000B, and MAX 7000S ordering codes Dec 200529 KB
PDN0510 Altera will be discontinuing select APEX 20K, APEX 20KC, APEX 20KE, APEX II, Classic, Configuration Device, FLEX 10KA, FLEX 10KE, FLEX 6000, FLEX 8000, MAX 7000, MAX 7000A, MAX 7000B, MAX 7000S, and MAX 9000 ordering codes Jul 200553 KB
PDN 0509 Altera will be discontinuing select Classic and MAX 9000 ordering codes Jun 200520 KB
PDN 0508 Altera will be discontinuing EPM7256A ordering codes Apr 200519 KB
PDN 0507 Altera will be discontinuing EPM7128A ordering codes Apr 200519 KB
PDN 0409 Altera has discontinued the ARM Developer Suite (ADS) Lite software tool for Altera Excalibur devices May 200411 KB
PDN 0408 Altera will be discontinuing the PCI APEX Development Kits, and PCI32 Nios Target Add-On Kit May 200412 KB
PDN0405 Altera has discontinued the Nios APEX Development Kits, Nios Ethernet Kit, and Nios Linux Development Kit. Apr 200412 KB
PDN0402 Altera has discontinued the printed version of the MAX+PLUS II manual. Jan 200413 KB
PDN0401 Altera will be discontinuing several APEX 20K ordering codes Jan 200413 KB
PDN 0316 Altera will be discontinuing certain APEX 20KE device ordering codes Dec 200312 KB
PDN 0315 Altera will be discontinuing certain configuration device ordering codes Dec 200311 KB
PDN 0314 Altera will be discontinuing certain configuration, FLEX 10KA, FLEX 10KE, FLEX 6000, and FLEX 8000 device ordering codes Dec 200314 KB
PDN 0313 Quartus II Software Support for Mentor Graphics Blast Software Oct 200314 KB
PDN 0312 Altera will be discontinuing the IP MegaCore products listed in Table 1 Sep 200318 KB
PDN 0311 Altera will be discontinuing the APEX DSP Development Kits Starter Version and Professional Edition products Aug 200380 KB
PDN 0307 Altera will be discontinuing the ByteBlasterMV parallel port download cable Jun 20037 KB
PDN 0303 Altera will be discontinuing some Excalibur board products Feb 200386 KB
PDN 0302 Altera will be discontinuing ordering codes: PCI-BOARD/A4E & PCI-BOARD/A4E/UNIV Jan 200376 KB
PDN 0221 Altera will be discontinuing ordering codes PCI-BOARD2/S & PCI-BOARD2/S/UNIV Dec 200279 KB
PDN 0220 FLEX 10KA Product Ordering Codes to Become Obsolete Dec 200285 KB
PDN 0218 Quartus II & MAX+PLUS II Software Operating System Support, October 30, 2002 Oct 200265 KB
PDN 0204 Altera will be discontinuing certain APEX 20K, APEX 20KE, FLEX 10KE, and ACEX 1K device ordering codes Apr 200215 KB
PDN 0203 Altera will be discontinuing certain MAX 7000S, MAX 7000A, and MAX 7000B device ordering codes Apr 200214 KB
PDN 0209 Altera will be discontinuing certain QFP programming and development sockets Mar 200211 KB
PDN 0124 Altera is discontinuing all extraction tools Dec 20018 KB
PDN 0122 Altera will be discontinuing the PL-ASAP2 programming hardware and the PL-MPU and PLP6 components that comprise the PL-ASAP2 product Nov 200157 KB
PDN 0118 Altera began launching new, flexible ways to purchase MegaCore IP functions Nov 2001101 KB
PDN 0117 Discontinued MAX 7000, MAX 9000, FLEX, and APEX 20K ordering codes, October 25, 2001 Oct 200112 KB
PDN 0110 PCI-Board2, SOPC-Board/A6E, SOPC-Board/A10E to Become Obsolete Apr 20019 KB
PDN 0107 Selected FLEX 8000, FLEX 10K, FLEX Devices 10KA, FLEX 10KE, and APEX 20K Jan 200111 KB
PDN 0106 Selected MAX 9000 Devices Jan 200111 KB
PDN 0103 Selected MAX 7000 Devices Jan 20018 KB
PDN 0102 Selected Classic Devices Jan 20018 KB
PDN 0007 EPF10K100B To Become Obsolete Jun 200010 KB
PDN 9917 Selected Adapters to Become Obsolete Dec 19999 KB
PDN 9907 EPM7032V to become obsolete Jun 199913 KB
PDN 9817 Fourteen maintenance products are being discontinued Oct 199814 KB
PDN 9816 Six development system products are being discontinued Aug 199810 KB
PDN 9713 EPM7256SRC208-12 Update Sep 19974 KB
PDN 9710 Selected programming adapters for the EPM5016 are being obsoleted Aug 19974 KB
PDN 9709 Discontinued ordering codes and replacement products for Altera development tools Aug 199748 KB
PDN 9625 FLASHlogic EPX880 & EPX8160 to Become Obsolete Dec 199650 KB
PDN 9624 MAX 5000 Update Dec 1996129 KB
PDN 9620 FLASHlogic Download Cable (PL-FLDLC) Sep 199685 KB
PDN 9618 Selected MAX 9000 Ordering Codes Sep 199685 KB
PDN 9610 In 1996, Altera will be consolidating the MAX 5000 device family which will result in selected device ordering codes being discontinued as shown in the Product Discontinuance Notice Apr 19969 KB
PDN 9603 Selected FLEX 8000 devices to be discontinued Feb 199691 KB
PDN 9601 EPX780 to be discontinued Jan 199696 KB
PDN 9517 FLEX 8000 & EPC1213 military device obsolescence schedule Dec 1995146 KB
PDN 9516 Selected MAX devices to be discontinued Dec 199530 KB
PDN 9513 Military products to be discontinued Jun 199548 KB
PDN 9512 Selected FLEX 8000 devices to be discontinued Jun 199585 KB
PDN 9511 This notice is to announce Altera's intent to discontinue the EP310I device in 1996. The schedule for phase-out is noted in the Product Discontinuance Notice Jun 19958 KB
PDN 9508 Selected Classic devices to be discontinued Jun 1995132 KB
PDN 9401 Phase-out of selected military devices previously acquired from Intel Jun 1995130 KB

Customer Advisory
Title Release Date File Size
ADV 1104 Rev 1.2.0 Second Foundry Source Qualification for the MAX II/G and MAX II Z Devices May 2012255 KB
ADV 1204 Additional Altera Company Label Included On the Moisture Barrier Bag for Altera Configuration Devices Apr 2012256 KB
ADV 1202 Full Laser Mark Introduction for Products Using Lidded/Heat Spreader Packages Feb 2012125 KB
ADV 1101 Enhancements to Altera Moisture Barrier Bag and Unit Box Labels Mar 2011477 KB
ADV 1103 Topside Mark Change for Altera Arria II GX Devices Jan 2011181 KB
ADV 1007 Rev 1.0.1 Additional Bump Line for Altera's Flipchip Devices Jan 2011156 KB
ADV 1005 Additional Assembly Site for the Arria II GX FBGA Package Oct 2010160 KB
ADV 0908 Rev 1.0.1 Product Shelf Life Extension to 36 Months Dec 2009275 KB
ADV 0907 Additional Assembly Plant for MBGA Packages Aug 2009133 KB
ADV 0901 Implementing New Shipping Carton Label Feb 2009517 KB
ADV 0813 Product Discontinuance Notice (PDN) Policy Nov 200818 KB
ADV 0812 Additional Package Option for Selected Stratix III FPGA Devices May 200866 KB
ADV 0804 TSMC Wafer Fabrication Sites for the Stratix III FPGA Family Mar 200825 KB
ADV 0217 Rev 1.1.0 Full Laser Marking Introduction Feb 200817 KB
ADV 0607 UFBGA 484 Package Coplanarity Enhancement Nov 200661 KB
ADV 0601 Rev01 Addition of Assembly Plant for FBGA Packages Mar 200622 KB
ADV 0505 Adding Daewon shipping tray for BGA and QFP Package Devices May 200521 KB
ADV 0501 Implementing Pb-Free Marking Codes and Indication on Labels Mar 20051 MB
ADV 0503 Serial Configuration Device Plating Standardization Mar 200516 KB
ADV 0502 Serial Configuration Device Plating Standardization Mar 200517 KB
ADV 0406 TQFP 32 Package Top Mold and Ejector Size Change May 200414 KB
ADV 0306 Introduction of Dual Marking on MAX 3000A Devices May 200356 KB
ADV 0305 Additional Source for Altera's PowerQuad Flat Pack Package for the FLEX 10K and APEX Device Families Mar 200382 KB
ADV 0202 Schedule for the MAX 7000AE and MAX 3000A transition to a 0.30-µm process at TSMC, Taiwan Feb 200213 KB
ADV 0201 Marking the assembly lot number and a one-line internal traceability code on all non-BGA packages Feb 200210 KB
ADV 0115 EP20K200E and EP20K300E 652-pin BGA packages will be reinforced with a stiffener Dec 20018 KB
ADV 0012 BGA Package Top Mark Enhancement Dec 20009 KB
ADV 0009 FLEX 10K Transition Schedule Update Sep 200010 KB
ADV 0003 Alternate QFP Shipping Trays Jan 200010 KB
ADV 0001 Additional Assembly Location Jan 200010 KB
ADV 9916 Top Mark Enhancement Nov 199911 KB
ADV 9914 Additional Assembly Source Aug 199910 KB
ADV 9912 FineLine BGA Packages Jun 199921 KB
ADV 9910 Test and Shipment Site Addition Apr 199912 KB
ADV 9909 EPF6016 and FLEX 10K Transition Schedule Update Apr 199918 KB
ADV 9906 Change in Tray Temperature Tolerance Mar 199911 KB
ADV 9904 Additional Source of Supply for Configuration Devices Jan 199920 KB
ADV 9814 PLCC Moisture Sensitivity Level Reclassification Aug 199812 KB
ADV 9812 EPC1064 and EPC1213 Transition Schedule Update Jul 199814 KB
ADV 9809 PL-MANUAL, PL-MANUALWS, PL-MNLVHDL, and PL-MNLVERILOG manuals to be consolidated into PL-MANUAL Jun 199810 KB
ADV 9803 EPM7032, EPM7160E, EPM9320, and EPM9560 Transition Schedule Update Mar 199812 KB
ADV 9801 FLEX 10K Moisture Rating Enhancement Jan 199813 KB
ADV 9712 FLEX 10K Additional Source of Supply Sep 199729 KB
ADV 9708 MAX 7000 & MAX 9000 0.5-micron Transition Schedule Update Jun 199733 KB
ADV 9707 Top Mark Traceability Enhancements May 199746 KB
ADV 9705 RQFP & TQFP Moisture Reclassification May 199759 KB
ADV 9701 Manufacturing Site Change Feb 199783 KB
ADV 9606 MAX 5000 Transition Schedule Update Feb 199739 KB
ADV 9623 FLEX 10K Ordering Code Change Dec 1996117 KB
ADV 9622 FLEX 8000 Ordering Code Change Dec 1996113 KB
ADV 9621 Classic Family Transition Schedule Update Nov 199691 KB
ADV 9617 Date Code Format Aug 199686 KB
ADV 9615 FLEX 10K Ordering Code Change Jun 1996143 KB
ADV 9614 Glass Seal PGA Jun 199681 KB
ADV 9611 New Assembly Site Jun 199681 KB
ADV 9608 EP9XX and EP18XX Ordering Code Change Mar 1996147 KB
ADV 9609 MAX 5000 Ordering Code Change Mar 1996148 KB
ADV 9607 Process transition update for Classic devices Jan 199683 KB
ADV 9518 Ordering code changes for EP6xx devices Dec 199587 KB
ADV 9505 FLEX 8000 devices in 208-, 240-, and 304-pin RQFP packages to be shipped in dry packs Jun 199552 KB
ADV 9515 Errata for Process Change Notification 9407 Jun 199552 KB
ADV 9507 Ordering code changes for Classic devices Jun 1995100 KB
ADV 9506 Ordering code change for the EPM7192, EPM7160, and EPM7128 devices Jun 199593 KB
ADV 9502 Transition from a dual mark to a single mark for all products acquired from Intel Apr 1995115 KB
ADV 9401 New marking procedure for 240- and 304-pin power quad flat pack (RQFP) packages Dec 199466 KB

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